Millimeter-Wave Integrated Circuits for Ultra High-Speed Wireless Board-to-Board Computer Communication (A01)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: from 2011 to 2020
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 164481002

The goal of project A01 is to study and realize Silicon mm-wave integrated circuits required for the wireless links of the HAEC Box, capable of 100 Gbit/s over a carrier of 180 GHz, with particular focus on the minimization of the energy required per transferred bit. This will be studied for the receiver frontend and the analog-to-digital converter (ADC) modules with focus on the adaptivity and tunability of circuits and systems to deliver optimal efficiency also at lower data rates than the maximum. In the mm-wave frontend, circuit blocks will be developed to operate in fast-wake-up mode. The power consumption of the ADC will be automatically minimized controlling the sampling rate with a delay-locked loop.

• DFG Programme: Collaborative Research Centres
• Subproject of: SFB 912: HAEC - Highly Adaptive Energy-Efficient Computing
• Applicant Institution: Technische Universität Dresden
• Project Head: Professor Dr.-Ing. Frank Ellinger