3D-conditioning of substrates for deposition of optical waveguides

• Applicants: Professor Dr.-Ing. Stefan Kaierle, since 3/2020; Professor Dr.-Ing. Ludger Overmeyer
• Subject Area: Production Automation and Assembly Technology ; Primary Shaping and Reshaping Technology, Additive Manufacturing
• Term: from 2014 to 2019
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 190714407

The subproject 1 examines the conditioning of the free surface energy of plastic films by means of flexographic printing. This conditioning of the film substrates is necessary for the wetting control for the subsequent application of optical waveguides in the research group. As an extension to the first funding period, there will be a need in the future for strain-compatible conditioning structures which allow a three-dimensional forming of the film substrates by means of thermoforming. In order to increase the integration density, the transition to three-dimensional opto-mechatronic interconnect devices is realized on the basis of these spatial substrates.The research in the subproject is divided into two complementary scientific questions. They allow, in cooperation the targeted implementation of three-dimensional substrates. The Suttmann working group investigates the beam-functionalization of printing plates in order to achieve a local control of the color transfer in the flexographic printing process. In contrast to the first funding period, not only the non-contacting edge area of the stamp is functionalized but also the contact-bearing end face. For this reason, a pressure-resistant modification of the surface is required by means of additive and subtractive beam techniques.The Overmeyer working group investigates how a locally acting wetting control can be used for the printing of strain-compatible conditioning structures. The beam-functionalized printing forms allow control of the printing area as well as the transferred material quantities. In addition to this, flexible conditioning materials as well as keep-out areas in the printing layout are examined. These complementary printing techniques are characterized in terms of their suitability for the thermoforming process. As a result of the production processes in subproject 1, the research group is provided with conditioned three-dimensional circuit carriers as the basis for a spatial optical bus system.

• DFG Programme: Research Units
• Subproject of: FOR 1660: Optical Design and Interconnection Technology for Assembly-Integrated Bus Systems
• Ehemaliger Antragsteller: Dr.-Ing. Oliver Suttmann, until 3/2020