System integration for optical and wireless Pbit/s communication in high performance computing (A10)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: from 2015 to 2020
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 164481002

Project A10 deals with the development of an electro-optical packaging of optical and wireless hybrid transceivers. For a complete co-integration of mm-wave and optical modules into a package, additive manufacturing (AM) methods using simultaneous IC-device embedding and chip-carrier fabrication with subsequent fabrication of RF and optical interconnect network will be developed. Using these methods, arrayed passive components (optical couplers, Butler matrices, and antennas) will be integrated with the embedded active IC-chips, in order to realize RF-E/O-transceivers.

• DFG Programme: Collaborative Research Centres
• Subproject of: SFB 912: HAEC - Highly Adaptive Energy-Efficient Computing
• Applicant Institution: Technische Universität Dresden
• Project Head: Professor Dr.-Ing. Karlheinz Bock