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Development of integrated and flexible thermoelectric micro generators (MiTEG)

Subject Area Microsystems
Term from 2019 to 2023
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 417306425
 
Final Report Year 2024

Final Report Abstract

The MiTEG project focused on the development of integrated and flexible manufacturing processes for micro-thermoelectric (TE) generators (µTEGs). These µTEGs, with edge lengths of around 10 mm or less, are able to convert temperature differences into small amounts of electrical energy and thus supply sensors and other devices. In two sub-projects, the project partners developed manufacturing processes for the use of TE semi-conductor materials (bismuth telluride-based), primarily in the field of energy generation, and TE metal alloys (CoNi and CuNi), primarily for use as Peltier elements for TE cooling. In the course of the project, substrates made of standard PCB material (FR4 with copper layers on both sides) were used and processed using a CNC milling machine to create hole patterns on one (single-sided process) or both sides (double-sided process). These holes were not drilled completely through the PCB material, but ended on the opposite copper layer and formed the basis for the electrical contact there. The manufacturing process for semiconductor TE materials developed in the project uses TE powder together with a solvent as a viscous paste. This paste is dispensed into the prepared holes, cured and compacted under the influence of heat. Finally, a layer of silver conductive paste is applied to the side that was used to apply the paste and the final µTEG is insulated and cut out using the CNC milling machine. The project was able to show that it is possible to produce µTEGs in this simple and costeffective way using existing technologies in the PCB industry. Furthermore, we have optimized ECD materials, including CoNi and Sb, for active cooling, and BiTeSe and Tellurium for refrigeration and power generation applications. TEDs were fabricated using CoNi and Sb as TE material, with above mentioned templates. In the course of the projects, we have also developed a new approach to geometry optimization. Where we optimize heights of p-and n-legs relative to each other. Using this technique, we have developed MEMs based μ-TED which showed a 37.5% enhancement in cooling power density while reducing Te usage by 42.5%. In power generation, we can increase the output power density by 55% while reducing Te usage by 70%. Additionally, PCB-based wire devices have been fabricated, using commercial TE wires are used as p-and n-legs. The simplicity of fabrication is an added advantage for commercialization of this process. The fields of application of the µTEGs produced in this way range from the power supply of individual sensors and small, close-to-body devices to PCB-integrated, electrically independent sensors or embedded monitoring systems without the option of changing batteries.

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