Project Details
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Detection of aging of power electronic modules through the evaluation of the magnetic field pattern

Subject Area Electrical Energy Systems, Power Management, Power Electronics, Electrical Machines and Drives
Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term from 2019 to 2022
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 423760882
 
Final Report Year 2022

Final Report Abstract

Within this project, the effect of chip solder and bond wire degradation on the magnetic field distribution above a power semiconductor was investigated. Of interest was the viability of the magnetic field distribution as a parameter to detect and monitor power module degradation. Therefore, samples consisting of a singular IGBT on DCB were manufactured and measurements were conducted. As a first step the influence of a defined solder interruption on the magnetic field was investigated, by partially replacing the chip solder with an insulating layer. Afterwards, 40 samples were artificially aged using power cycling tests with the goal to achieve a more realistic degradation pattern. The influence of the observed degradation patterns on the magnetic field distribution was measured and evaluated. Based on an analytical bond wire model an approach to estimate the bond wire current distribution utilising measured B-field values was developed.

Publications

  • ”Alterungsbestimmung von Leistungselektronik Aufbau-Verbindungstechnik durch Auswertung der Magnetfeldsignatur”, DE10 2018 131 644.5, 10.06.2020
    G. Griepentrog und M. Wolff
  • "A New Approach for Detection of Aging of Power Modules by Evaluation of the Magnetic Field”. In: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. 2021, pp. 1–8
    M. Wolff und G. Griepentrog
  • ”Determination of Ideal Magnetic Sensor Arrangements for Health Monitoring of Power Electronic Modules”. In: PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. 2022, pp. 1-6
    H. Huai, M. Wolff, N. Naserizaker, E. Ehret, G. Griepentrog und J. Wilde
  • ”The Impact of Power Cycling Induced Degradation Mechanisms on the Magnetic Field Signature of IGBTs”. In: PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. 2022, pp. 1-6
    M. Wolff und G. Griepentrog
 
 

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