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Institution
Technische Universität Dresden
Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT)
Address
Mommsenstraße 15
01069 Dresden
Deutschland
GERiT
This institution in GERiT
01069 Dresden
Projects
Research Grants
Current projects
Inline quality control system for functional conductive 3D printing (PROPRIIS)
(Applicants
Drossel, Welf-Guntram
;
Heuer, Henning
)
Research and modelling of the multi-coil frequency division multiplexed eddy current methodology for the precise depth determination of characteristics in carbon fiber based structures
(Applicants
Cherif, Chokri
;
Heuer, Henning
)
Completed projects
Enhancement of Dynamic Stiffness and Precision of Active Magnetic Bearings by Using Integrated Flux Density Measurement and Fast Switching Converter Topologies
(Applicants
Hofmann, Wilfried
;
Schmidt, Oliver G.
;
Zerna, Thomas
)
Nondestructive inspection for cracks detection in welded joints of clad steel by radio wave techniques
(Applicant
Heuer, Henning
)
Plasma activation and Plasma passivation for fluxless soldering
(Applicant
Herzog, Thomas
)
Qualitätsoptimierung in der Elektronikfertigung mit Hilfe von Data Mining Techniken
(Applicant
Wolter, Klaus-Jürgen
)
Quantitative Lebensdauerprognose für Chip- und Anschlußkontaktanordnungen moderner Schaltkreise und Mikrosysteme
(Applicant
Meusel, Ekkehard
)
Research on Inner Polar Phase effects for high frequency absorbing materials
(Applicant
Heuer, Henning
)
RResearch and development of algorithm for determination of absolute conductivity value without calibration by eddy current techniques
(Applicants
Heuer, Henning
;
Wensch, Jörg
)
Research Units
Completed projects
FOR 1660: Optical Design and Interconnection Technology for Assembly-Integrated Bus Systems
(Spokesperson
Franke, Jörg Ernst
)
Technologies for robust optical coupling of integrated waveguides during field assembly in extended structures
(Applicant
Wolter, Klaus-Jürgen
)
Technology for an adapitve optical bus-coupling on three-dimensional structures
(Applicant
Bock, Karlheinz
)
Collaborative Research Centres
Completed projects
Polymere als Zwischenebenenisolatoren in Mehrebenenmetallisierungssystemen
(Project Heads
Meusel, Ekkehard
;
Wenzel, Christian
)
System integration for optical and wireless Pbit/s communication in high performance computing
(Project Head
Bock, Karlheinz
)
Research Training Groups
Completed projects
GRK 51: Sensor Technology
(Spokesperson
Gerlach, Gerald
)
GRK 1401: Nano- and Biotechniques for Electronic Device Packaging
(Spokesperson
Gerlach, Gerald
)
Major Instrumentation Initiatives
Completed projects
Measurement-Platform for Ultra-High Data-Rates (MORE)
Clusters of Excellence (ExStra)
Current projects
EXC 2050: Centre for Tactile Internet with Human-in-the-Loop (CeTI)
(Spokespersons
Fitzek, Frank Hanns Paul
;
Li, Ph.D., Shu-Chen
;
Strufe, Thorsten
)
Additional Information
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