NEMS/MEMS and Nanomaterial-enhanced Passive Components Compatible with Advanced Nano-CMOS for Future One-chip Tunable RF Systems
Final Report Abstract
It could be proven that the LTCC based anodic bonding can be applied in the same way as the conventional borofloat based anodic bonding for integrated micro devices in the case a surface treatment by O2 Plasma is used. The LTCC has the big benefit of the possibility of inherently integrated electrical feed troughs. For conventional material they have to be fabricated by expensive and complex additional processes. This allows designing and fabricating a number of micro devices in a way that could not be done before. Even if electric double-layer capacitors seem to be not relevant for radio frequency range, there is still a strong relevance in other fields. These devices can replace for instance usual capacitors in DC or low frequency applications and thus contribute to a further device miniaturization which is a strong trend in society nowadays. A replacement of rechargeable batteries with electric double-layer capacitors can lead to ultra-fast charging and thus to more flexibility and mobility for people. As we have successfully demonstrated the prototypic fabrication within a technological silicon process, a cost-efficient batch processing of such devices is possible. Based on the results of the project already a LTCC producing company, as well as the research institute Fraunhofer IKTS (Institute for Ceramic Technologies and Systems) showed interest for future applications, and discussions are ongoing.
Publications
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NEMS/MEMS and passive components integration by using novel LTCC substrate, Smart Systems Integration, Como (Italy), 2010
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.
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NEMS/MEMS Integration for future One-chip mobile RF-systems, DFG Workshop on nanoelectronics, Bad Honnef (Germany), 2010
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.
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Bonding of Si/Ceramic heterogeneous substrates at low temperatures, Joint DFG/JST Project Seminar NEMS/MEMS and Nanomaterial-enhanced Passive Components, Chemnitz (Germany), 2012
Froemel,J.; Wuensch,D.; Wiemer,M.; Gessner,T.
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Micro Electronic Double Layer Capacitor; Joint DFG/JST Project Seminar NEMS/MEMS and Nanomaterial-enhanced Passive Components, Chemnitz (Germany), 2012
Gabler,F.; Froemel,J.; Gessner,T.
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Functional liquids within NEMS/MEMS fabrication; Joint DFG/JST Project Seminar Micro Integrated Devices; Sendai (Japan), 2013
Gabler,F.; Froemel,J.; Gessner,T.
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LTCC-Based three dimensional inductors with nano-ferite based embedded core for one-chip tunable RF-systems; Solid-State Sensors, Actuators and Microsystems: The 17th International Conference on; Barcelona (Spain), 2013
Lin,Y.-C.; Gabler,F.; Tsai,Y.-C.; Tanaka,S.; Esashi,M.; Gessner,T.
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Smart Systems Integration by using Micro- and Nanotechnologies; Joint DFG/JST Project Seminar Micro Integrated Devices; Sendai (Japan), 2013
Gessner,T.
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Wafer level bonding of heterogeneous substrates at low temperature; Joint DFG/JST Project Seminar Micro Integrated Devices; Sendai (Japan), 2013
Froemel,J.; Wuensch,D.; Braeuer,J.; Esashi,M.; Gessner,T.
