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Simulation of adhesives curing and shrinking processes within piezo-metalcomposites (C07)

Subject Area Metal-Cutting and Abrasive Manufacturing Engineering
Term from 2010 to 2018
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 21440441
 
The subproject C07, as part of the working group of forming, deals with the development of reliable methods for characterization and simulation of the hardening of structural adhesives which are applied for the production of novel formable piezo-aluminum-sheet-composites. With respect to an aimed series production process, research will be extended to heat-curing adhesives within the third funding period. This requires further development of the constitutive models, simulation tools and experimental methods. Furthermore, a spatially and temporally optimized temperature control for the series production process will be developed.
DFG Programme CRC/Transregios
Applicant Institution Technische Universität Chemnitz
 
 

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