Project Details
Projekt
New bonding of electro-optical integrated circuits in foil substrates (D02 (A05))
Subject Area
Plastics Engineering
Term
from 2013 to 2017
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 210420491
Optodic bonding of optoelectronic components yields bonds with a high mechanical strength, good electrical conductivity and suitable thermal stability, thus facilitating the coupling between optoelectronic devices and waveguides. In Subproject D02, we will address issues of heat dissipation as well as optimized coupling of light into the passive components using metal gratings. A previously-developed coating process known as Flip-and-Fuse will be employed.
DFG Programme
CRC/Transregios
Subproject of
TRR 123:
Planar Optronic Systems (PlanOS)
Applicant Institution
Gottfried Wilhelm Leibniz Universität Hannover
