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Terahertz quantum cascade lasers based on interface roughness engineering in InGaAs/InAlAs heterostructures on InP

Subject Area Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term from 2014 to 2024
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 248490517
 
Final Report Year 2024

Final Report Abstract

The major achievements of the project are: 1. Demonstration of the successful 2”-scale wafer-bonding process and the resulting successful metal-metal waveguide fabrication, lasing at 17µm in pulsed mode and delivering up to mW of pulse power. 2. Demonstration of Peltier-cooled THz QCL operation using an externally provided (TU Vienna) QCL chip and in-house designed multi-stage TEC-setup. The major surprise was the inability of the longer wavelength designs as grown to lase.

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