Integritätsbewertung smarter Patches auf hygrothermalpiezoelektrischen Leichtbaustrukturen

• Antragsteller: Professor Dr.-Ing. Wilfried Becker
• Fachliche Zuordnung: Mechanik ; Materialien und Werkstoffe der Sinterprozesse und der generativen Fertigungsverfahren
• Förderung: Förderung in 2015
• Projektkennung: Deutsche Forschungsgemeinschaft (DFG) - Projektnummer 277522030

• Erstellungsjahr: 2015

Zusammenfassung der Projektergebnisse

The analytical model was set up and the interface debonding for the overlap zone of a smart patch/layer configuration under combined load at environmental conditions is derived and found. The numerical examples give the hygrothermopiezoelectric behaviours of the considered three types of lightweight structures and are illustrated by figures and discussed. A possible criterion for detection of the debond length through the value of the electric gradient is proposed. Some preliminary results about safety intervals of the model parameters as well as the safety zones are obtained via optimal analysis, using BASIC GA.

Projektbezogene Publikationen (Auswahl)

• Interface delamination in solar energy devices, Vth international science conference “Education, science, innovations” ESI’2015, 10 June 2015, European Polytechnical University, Pernik, Bulgaria, Book of abstracts, p.52
  T. Petrova, W. Becker, E. Kirilova, J. Ivanova
  
• Interfacial Debonding of a Piezoelastic Bi-Material Structure Applicable for Wind Rotor Blades, Mechanics of Advanced Materials and Structures (2015) 22, 813–818
  J. Ivanova, V. Valeva, T. Petrova, W. Becker
  
• Piezomonitoring of unit solar cell under mechanical and electrical loading at environmental conditions, IInd International Conference “New Trends in the Applications of Differential Equations in Sciences”, 6-10 July, 2015, Institute of mathematics and informatics – BAS, Sofia, Bulgaria
  W. Becker, T. Petrova, J. Ivanova, E. Kirilova