Shear-Lag-Analyse dynamisch belasteter smarter Pflaster-Substrat-Strukturen mit Interface-Defekten
Zusammenfassung der Projektergebnisse
An analytical model was set up and the interface debonding for the overlap zone of a smart patch/layer configuration with interfacial defect (gap) under combined time harmonic extensional and electric load at environmental conditions is derived and the solutions are found in a closed form. The numerical examples give a clear picture for the hygrothermopiezoelectric behaviour of the considered already damaged interface (by gap) and for the continuous one. The obtained results for the interface shear stress, electric gradient and debond lengths are illustrated by figures and discussed. The influence of the size and position of the gap along the interface on the interface debond length is also studied, illustrated and discussed. After validation of the model, the optimal analysis (by genetic algorithm) is performed and the values of the parameters of three structures with different positions of the interfacial defect corresponding to the minimum debond length are found. The obtained optimal parameters ensure a vanishing/minimal debond length of the structure and safe work as well. The substantial model parameters are selected by additionally provided parametric analysis of the optimal solutions.
Projektbezogene Publikationen (Auswahl)
- Effect of an interface defect in a patch/layer joint under dynamic time harmonic load, ”, in: Proceedings of XI conference of Steel and Composite Construction, 23-24 November, 2017, Coimbra iParque, Coimbra, Portugal, pp. 795-805
E. Kirilova, W. Becker, J. Ivanova, T. Petrova
(Siehe online unter https://doi.org/10.1002/cepa.543) - “Modeling of Smart Patch/Layers Joints Under Dynamic Time Harmonic Load with Interface Defect”, in: Proceedings of XI conference of Steel and Composite Construction, 23-24 November, 2017, Coimbra iParque, Coimbra, Portugal, pp. 953-963
T. Petrova, W. Becker, E. Kirilova, J. Ivanova
(Siehe online unter https://doi.org/10.1002/cepa.548)
