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Projekt Druckansicht

Transformierbares 3D Elektrodensystem zur Benetzung von biologischen Geweben

Fachliche Zuordnung Mikrosysteme
Biomaterialien
Herstellung und Eigenschaften von Funktionsmaterialien
Förderung Förderung von 2017 bis 2021
Projektkennung Deutsche Forschungsgemeinschaft (DFG) - Projektnummer 388060870
 
Erstellungsjahr 2021

Zusammenfassung der Projektergebnisse

Research project in Rogers research group has been to develop new 3D electronics with various functions that are difficult to achieve using existing techniques. Recently developed methods for forming 3D systems exploit stress release in pre-stretched elastomer substrates as the driving force for the assembly of 3D functional microdevices from 2D precursors. My primary project integrates biodegradable materials into 3D structures to serve as the basis for 4D, or transformable 3D architectures and functional electronic devices. Such unusual devices could create opportunities for novel applications for 3D assembly techniques, such as medical devices, microrobotics, and flexible electronics. The next project involves soft materials encapsulated into a 3D piezoresistive sensor to serve as a low-pressure range (0-50 mmHg) sensor. The sensor is integrated into wirelessly transmitted wearable devices and clinically validated with patients at Northwestern Memorial Hospital. The devices, which monitor the interface pressure and skin temperature during compression therapy, have been successfully validated. The last project is to develop 3D neural interfaces. Departing from existing in vitro 2D culture systems, all parts of our body are made up of 3D geometries. Advanced 3D culture systems (known as spheroids, organoids and assembloids) have been introduced and intensively investigated using human induced pluripotent stem cells (hiPSCs). However, because prevailing characterization systems are still based on 2D geometries, there is a huge need for three dimensional frameworks including bioelectronic devices for biological studies. In this project, I introduced a qualitatively distinct type of 3D neural interface platform that exploits reversible engineering control over shape, size and geometry to match organoids/spheroids of interest, with multimodal engagement. The ability to exploit the most advanced planar electronic and optoelectronic technologies in these platforms represents a key additional unique feature in this context, for various types of high performance, high resolution functionality relevant to neural interfaces. Complex frameworks as extensions of these concepts offer additional options to precisely and deterministically form assembloids using spheroids as building blocks. Studies of cortical spheroids formed with human induced pluripotent stem cells (hiPSCs) demonstrate all of the important aspects of this form of 3D neurotechnology. The work reported in this project establishes a versatile 3D neural interface with unique capabilities in fundamental studies of spheroids, organoids and assembloids. Such culture systems have already contributed much to our understanding of neurodevelopmental disorders, such as microcephaly, and neurodegenerative disorders, such as Parkinson’s and Alzheimer disease. Most neurological disorders arise, however, from abnormal function in brains with normal structures. Organoids and assembloids have the potential to reproduce such functional abnormalities and the 3D neurotechnology platform introduced will harness that potential with greater detail and efficiency than can be realized using conventional methodologies. I demonstrated electrical, optical, and thermal modulation through integrated devices along with electrochemical sensing of oxygen level. Diverse biological studies including drug discovery, disease modeling and rehabilitation of injured brains can be conducted with the introduced system. My ongoing and future research goals are to develop 3D structures by integrating the most advanced sensors and modulators for various biological studies.

Projektbezogene Publikationen (Auswahl)

  • "Transformable, Freestanding 3D Mesostructures Based on Transient Materials and Mechanical Interlocking," Advanced Functional Materials 29, 1903181 (2018)
    Y. Park, H. Luan, K. Kwon, S. Zhao, D. Franklin, H. Wang, H. Zhao, W. Bai, J.U. Kim, W. Lu, J.-H. Kim, Y. Huang, Y. Zhang and J.A. Rogers
    (Siehe online unter https://doi.org/10.1002/adfm.201903181)
  • "Wireless, skin-interfaced sensors for compression therapy", Science Advances 6. eabe1655 (2020)
    Y. Park, K. Kwon, S. S. Kwak, D. S. Yang, J. W. Kwak, H. Luan, K. S. Chun ,H. J. Ryu, T. S. Chung, J. U. Kim, H. Jang, H. Jeong, S. M. Won, I. Jung, S. Xu, J. A. Rogers
    (Siehe online unter https://doi.org/10.1126/sciadv.abe1655)
  • "The Materials Chemistry of Neural Interface Technologies and Recent Advances in 3D Systems," Chemical Reviews, (2021)
    Y. Park, T. S. Chung, G. Lee, J. A. Rogers
    (Siehe online unter https://doi.org/10.1021/acs.chemrev.1c00639)
  • "Three dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids," Science Advances, 7. eabf9153, (2021)
    Y. Park, C. Franz, H. Ryu, H. Luan, K. Cotton, J. U. Kim, T. Chung, S. Zhao, A. Vazquez-Guardado, D. S. Yang, K. Li, R. Avila, J. Phillips, M. Quezada, H. Jang, S. S. Kwak, S. M. Won, K. Kwon, H. Jeong, A. J. Bandodkar, M. Han, H. Zhao, G. R. Osher, H. Wang, K. Lee, Y. Zhang, Y. Huang, J. D. Finan, J. A. Rogers
    (Siehe online unter https://doi.org/10.1126/sciadv.abf9153)
  • "Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds," Nature, 597, 503 (2021)
    B. H. Kim, K. Li, J.-T. Kim, Y. Park, H. Jang, X. Wang, Z. Xie, S. M. Won, W. J. Jang, K. H. Lee. T. S. Chung, Y. H. Jung, S. Y. Heo, Y. Lee, J. Kim, T. Cai, Y. Kim, P. Prasopsukh, Y. Yu, X. Yu, H. Luan, H. Song, F. Zhu, Y. Zhao, L. Chen, S. H. Han, J. Kim, H. Lee, C. H. Lee, Y. Huang, L. P. Chamorro, Y. Zhang, J. A. Rogers
    (Siehe online unter https://doi.org/10.1038/s41586-021-03847-y)
  • “Transparent, compliant 3D mesostructures for precise evaluation of mechanical characteristics of organoids,” Advanced Materials, 33(25) 100026 (2021)
    H. Ryu, Y. Park, H. Luan, G. Dalgin, K. Jeffris, T. S. Chung, H.-J. Yoon, J. U. Kim, S. S. Kwak, G. Lee, H. Jeong, J. Kim, W. Bai, Y. Huang, J. D. Finan, J. A. Rogers
    (Siehe online unter https://doi.org/10.1002/adma.202100026)
 
 

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