3D Printed Dielectric Structures for THz Applications ((2)-C13)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: from 2019 to 2020
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 287022738

The objective of this project is to enable true monolithic 3D ceramic THz components for highly accurate localization purposes, which operate in the mm- and sub-mm wavelength range. For this purpose, a novel emerging 3D printing technology is introduced into the field of THz research, which is “Lithography-based Ceramic Manufacturing”. With currently no THz application of this technology, this project will further develop the technique for sub-mm wave applicability. This will enable unseen device possibilities and complexity in the THz frequency range, which go beyond the state of the art of classical 2.5D subtractive manufacturing, as well as current 3D printing technologies.

• DFG Programme: CRC/Transregios
• Subproject of: TRR 196: Mobile Material Characterization and Localization by Electromagnetic Sensing
• Applicant Institution: Universität Duisburg-Essen
• Project Head: Professor Dr.-Ing. Niels Benson