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Scaling and Transfer Effects in Reactive Materials

Subject Area Metallurgical, Thermal and Thermomechanical Treatment of Materials
Synthesis and Properties of Functional Materials
Mechanical Properties of Metallic Materials and their Microstructural Origins
Thermodynamics and Kinetics as well as Properties of Phases and Microstructure of Materials
Term from 2019 to 2024
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 426337931
 
Final Report Year 2024

Final Report Abstract

In this project methods and defines fundamental rules to control the self-sustained reaction propagation by structuring the reactive multilayers and modulating the embedding environment using the processing steps of semiconductor processing technology. As a model system Ni/Al was chosen with a given binary layer thickness. The effect of the lateral dimension, and the spatial arrangement on the propagation velocity and maximum temperature of the reaction front, and the phase formation was investigated. Different models were developed to simulate the characteristic properties like propagation velocity and maximum reaction temperature of the self-sustained reaction on substrates and in heterogeneous multimaterial systems to assist the design of the test chips and the interpretation of the results. The project addressed the following questions: What is the effect of lateral and vertical confinements and the related reaction path on the properties of the self-sustained reaction? How can free surfaces and a materials environment of locally adjusted thermal conductivities be exploited to control the reaction path? How does the structuring of reactive multilayer affect the reaction and heat propagation? Can general rules for reaction propagation and transfer be formulated? Can the gained knowledge be applied for joining process of chiplets? Beside the answer on the questions a new local deposition process for reactive multilayers was developed mimicking the limitations of the sputtering and lift-off technology. Focusing on scaling and transfer processes the project contributed to the investigation and formulation of fundamental rules as a precondition of reactive materials integration into joining technology for different application fields. Based on a developed technique of integrity realization of intermetallics formation by self-sustained reactions an application in the field of flexible and stretchable electronics as well as formation of wide band gap semiconductors are demonstrated.

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