Influence of surface topography and chemistry on the wetting behavior of laser-patterned, metallic surfaces
Final Report Abstract
The wetting of technical surfaces has gained growing interest recently due to its great impact on a broad variety of technical relevant phenomena: Wetting influences corrosion behavior, bonding of surfaces with other materials like glue, paint or other metals, antimicrobial properties as well as cell adhesion and tribological performance. The wettability itself, on the other hand, is influenced by factors such as surface topography and chemistry. The roughness of a sample often determines transitions ranging from complete wetting of all structures (Wenzel type), through a variety of mixed states, to wetting only the roughness peaks with air inclusions in the roughness valleys (Cassie-Baxter type). Besides topography, chemistry can show a pronounced influence on the wetting behavior due to a polar surface termination leading to hydrophilicity or nonpolar surfaces depicting hydrophobicity. The project aimed at providing new insight into the role of both – chemical and topographical – influences on the wetting behavior. Copper was chosen as a model material due to its strong application in different sectors (heat transfer, antimicrobial surfaces, corrosion protection, electrical connectors…). Metallographic preparation is the basic for every subsequent sample modification, which is why a preparation and cleaning protocol was established in the first place. Wetting characterization was conducted by static contact angle (SCA) measurements – the most popular method for wetting analysis. A detailed study about preparation and measurement induced influences on SCA measurements was conducted in order to set standards for subsequent characterizations in the project and for the scientific community and to identify relevant parameters like sample packaging and storage. Especially sample storage showed significant influence on the SCA due to the adsorption of volatile hydrocarbon groups which were analysed in detail by XPS and TOF-SIMS. Before producing complex surfaces by direct laser interference patterning combining anisotropic hierarchical topography with oxidic chemistry modification, fundamental relations between the wetting behavior and intrinsic material properties like grain size and deformation were found to especially influence freshly prepared surfaces. In a final study, the gained knowledge was implanted to conduct a complex multi-scale study on the wetting behavior of copper. Influence of aging, oxidic state, isotropic as well as anisotropic topography by DLIP was analyzed experimentally and gives a profound insight into the wetting dynamics of water on copper.
Publications
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Patience Alone is not Enough – A Guide for the Preparation of Low-Defect Sections from Pure Copper. Practical Metallography, 58(7), 388-407.
Lößlein, S. M.; Kasper, M.; Merz, R.; Pauly, C.; Müller, D. W.; Kopnarski, M. & Mücklich, F.
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An in-depth evaluation of sample and measurement induced influences on static contact angle measurements. Scientific Reports, 12(1).
Lößlein, Sarah Marie; Merz, Rolf; Müller, Daniel Wyn; Kopnarski, Michael & Mücklich, Frank
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Topography versus chemistry – How can we control surface wetting?. Journal of Colloid and Interface Science, 609, 645-656.
Lößlein, Sarah Marie; Mücklich, Frank & Grützmacher, Philipp G.
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Von feinkristallin bis Grobkorn – Wärmebehandlung, Präparation und Analyse von Kupfer, Metallographietagung 2022, September 21-23 2022 (oral poster presentation)
S. M. Lößlein, R. Merz, M. Kopnarski & F. Mücklich
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The Influence of Adventitious Carbon Groups on the Wetting of Copper: A Study on the Effect of Microstructure on the Static Contact Angle. Langmuir, 39(34), 12020-12031.
Lößlein, Sarah Marie; Merz, Rolf; Müller, Daniel W.; Kopnarski, Michael & Mücklich, Frank
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Von hydrophil bis hydrophob – Über das Benetzungsverhalten von Reinkupfer, Kupfersymposium 2023, Jena, November 28-30 2023 (presentation)
S. M. Lößlein, R. Merz, D. W. Müller, M. Kopnarski & F. Mücklich
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Wetting properties - How we determine one of the most important parameters for the antimicrobial activity of surfaces, BioMAT 2023, May 03-04 2023 (presentation)
S. M. Lößlein, R. Merz, D. W. Müller, M. Kopnarski & F. Mücklich
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Influence of chemistry and topography on the wettability of copper. Journal of Colloid and Interface Science, 670, 658-675.
Marie, Lößlein Sarah; Merz, Rolf; Rodríguez-Martínez, Yerila; Schäfer, Florian; Grützmacher, Philipp G.; Horwat, David; Kopnarski, Michael & Mücklich, Frank
