Influence of undeformed chip parameters on material load and resulting subsurface damage when ultra-precision grinding of hard and brittle materials with coarse-grained diamond grinding wheels
Final Report Abstract
The use of single-coated, electroplated coarse-grained diamond grinding wheels is possible for precision grinding under certain conditions. The motivation for using coarse-grained diamond grinding wheels for precision grinding is the wear resistance of the tools compared to the fine-grained diamond grinding wheels usually used for this process. The longer service life leads to greater economic efficiency, as iterative dressing processes are eliminated and subsequent fine grinding and polishing times of the workpiece can be reduced. In this research project, load stresses in the contact zone were determined for the first time when using diamond grinding wheels with grit sizes between D301 and D1001 for ductile machining of brittle-hard materials. The stresses determined can be correlated with the prevailing material removal mechanism and the surface roughness achieved. In most cases, the calculation of chip thicknesses, which determine the material removal mechanism (ductile/brittle), is based on phenomenological approaches. However, their accuracy in predicting material removal is limited. The reason for this is the influence of the grinding wheel topography, which is generally taken into account in the calculation formulae for the process-dependent maximum chip thickness, but is of a statistical nature. In the case of coarse-grained tools, however, no statistical values can be assumed for the number of cutting edges or the grain shape, which are included in the calculation. As with a milling process, few cutting edges come into contact with coarse-grained tools. It is therefore necessary to describe the entire grinding wheel topography, which was done in this research project. Analysing the topography in the grinding direction made it possible to determine the normal and tangential surfaces that are in contact with the workpiece during the grinding process. The high-resolution measurement of process forces in combination with the previously determined contact surfaces made it possible to calculate load stresses in the contact area.
Link to the final report
https://oa.tib.eu/renate/handle/123456789/22175
Publications
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Precision grinding of N-BK7 glass with coarse-grained diamond grinding wheels. Vortrag: Schleiftagung, Fellbach (online), 26.01.2022-27.01.2022
Adam, B., Riemer, O. & Heinzel, C.
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Precision grinding of BK7 glass with coarse-grained diamond grinding wheels. EUSPEN - International Conference of the European Society for Precision Engineering and Nanotechnology, Technical University of Denmark, Copenhagen, DK, 12-16 June 2023. Riemer, O., Nisbet, C., Philips, D., Hrsg. Technical University of Denmark, Copenhagen, DK: euspen, 2023, 501-502. ISBN: 978-1- 9989991-3-2.
Adam, B., Riemer, O., Rickens, K. & Heinzel, C.
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Precision machining of glassy carbon. EUSPEN - International Conference of the European Society for Precision Engineering and Nanotechnology, Technical University of Denmark, Copenhagen, DK, 12-16 Jun 2023. Riemer, O., Nisbet, C., Philips, D., Hrsg. Technical University of Denmark, Copenhagen, DK: euspen, 463-466. ISBN: 978-1-9989991-3-2.
Schönemann, L., Adam, B., Riemer, O. & Karpuschewski, B.
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Precision machining of glassy carbon. Vortrag: EUSPEN - International Conference of the European Society for Precision Engineering and Nanotechnology, Technical University of Denmark, Copenhagen, 12-16 Jun 2023
Schönemann, L., Adam, B., Riemer, O. & Karpuschewski, B.
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Application of coarse-grained grinding wheels for precision grinding of glassy carbon. The 20th International Conference on Precision Engineering, Sendai, Japan, 23.10.2024. Sendai, Japan
Karpuschewski B., Heinzel C., Riemer O., Rickens K. & Adam B.
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Application of coarsegrained grinding wheels for precision grinding of glassy carbon, Vortrag: The 20th International Conference on Precision Engineering, Sendai, Japan, 23.10.2024
Karpuschewski B., Heinzel C., Riemer O., Rickens K. & Adam B.
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Precision plunge grinding with coarse-grained diamond grinding wheel. EUSPEN - International Conference of the European Society for Precision Engineering and Nanotechnology, University College Dublin, Ireland, IE, 10-14 Jun 2024. Riemer, O., Nisbet, C., Philips, D., Hrsg. University College Dublin, Ireland, IE: euspen, 218-284. ISBN: 978-1-9989991-5-6.
Adam, B., Riemer, O., Rickens, K. & Heinzel, C.
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Precision plunge grinding with coarsegrained diamond grinding wheel. Vortrag: EUSPEN - International Conference of the European Society for Precision Engineering and Nanotechnology, University College Dublin, Ireland, 10-14 Jun 2024
Adam, B., Riemer, O., Rickens, K. & Heinzel, C.
