Wafer alignment and bonding system

• Subject Area: Systems Engineering ; Materials Science
• Term: Funded in 2020
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 457077033

We request support in the acquisition of a wafer alignment and bonding system capable of performing optical alignment and bonding of the sample and host substrates, including those not transparent in visible and near-infrared. The instrument should be able to work with samples ranging in size from full wafers 75 mm (3 inches) in diameter to approximately 1cm x 1 cm wafer chips. The instrument should be able to perform thermocompression metal-metal bonding, adhesive bonding, and direct bonding.

• DFG Programme: Major Research Instrumentation
• Major Instrumentation: Gerät für Wafer-Align und Bond Prozesse
• Instrumentation Group: 2160 Lötmaschinen, Lötbäder, Kontaktiergeräte
• Applicant Institution: Technische Universität München (TUM)
• Leader: Professor Mikhail Belkin, Ph.D.