Systemplattformen zu hybriden Mikrointegration (A 5)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: from 2000 to 2009
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 5481537

No abstract available

• DFG Programme: Collaborative Research Centres
• Subproject of: SFB 440: Assembly of hybrid Microsystems
• Major Instrumentation: Flip-Chip-Bonder
• Applicant Institution: Rheinisch-Westfälische Technische Hochschule Aachen
• Project Head: Professor Dr. Wilfried Mokwa