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Reduction of the thermal cycling stress of power semiconductors by non-linear phase change cooling

Subject Area Electrical Energy Systems, Power Management, Power Electronics, Electrical Machines and Drives
Term since 2024
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 549893532
 
This proposal aims to investigate an unconventional type of cooling that works on top of a power semiconductor chip by a non-linear thermal capacitance. This is intended to reduce the thermal impedance in specific time ranges specifically. This cooling method is to be implemented through the phase change of a material, preferably liquid-gaseous, with the medium only being in indirect contact with the chip to prevent chemical reactions and ensure electrical insulation. The second aspect of the investigation concerns a method investigation or development; here, the modeling of such a non-linear cooling is to be researched to predict the power chip's temperatures based on load profiles.
DFG Programme Research Grants
 
 

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