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Modeling the RF properties of printed materials and their surfaces

Subject Area Communication Technology and Networks, High-Frequency Technology and Photonic Systems, Signal Processing and Machine Learning for Information Technology
Term since 2025
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 528402728
 
Under the overall objective of the research group to create the foundations of a design methodology and manufacturing process technology for spatial RF components and systems, this subproject covers the aspects of field-theoretical modeling of the materials used and their surfaces, which are necessary for a predictive simulation in the design process. The basis for this is research into the interactions between the parameters of the manufacturing process and the subsequent electrical transmission properties. First, modeling approaches for additively manufactured dielectric and conductive material distributions are investigated with the aim of providing effective material parameters for the design of complex high-frequency systems. This is followed by the parameterization of two-wire line models depending on the process parameters, which creates the basis for a high-frequency-compatible assembly and interconnect technology. This includes the targeted reduction of signal attenuation through planarization layers, the increase in lifetime through encapsulation layers and the low-reflection crossing of cables as well as low-reflection component transitions.
DFG Programme Research Units
 
 

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