Project Details
Projekt
3D Architecture Schemes and Processes (C01)
Subject Area
Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term
since 2025
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 528378584
This project has the central task of tying together the technological infrastructures and supplying technologies to connect the individual elements developed in Research Areas A and B. Scientifically, new contacting, wiring, local interconnection and integration schemes will be necessary. An important aspect will be the research on novel atomic layer deposition and atomic layer etching processes that are not existing currently but will be required to combine the different elements. The non-programmable wiring schemes which will be strongly diverging from the state of the art in terms of materials and process integration will be in the focus. Connecting the cleanroom infrastructures at three different sites and at least six different labs is another important aspect and standardized sample formats, run-sheets, lithography marks etc. need to be defined and rolled out to the different labs.
DFG Programme
CRC/Transregios
Subproject of
TRR 404:
Next Generation Electronics with Active Devices in Three Dimensions (Active-3D)
Applicant Institution
Technische Universität Dresden
Co-Applicant Institution
Rheinisch-Westfälische Technische Hochschule Aachen
