Components for Mobile Broadband Passive Imaging Systems (C08)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering ; Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: since 2017
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 287022738

C08 focuses on exploring the Terahertz (THz) frequency range to utilize novel passive imager architectures using cutting-edge silicon technologies. In the frequency range below 2 THz, silicon-integrated electronic circuits such as high gain Low Noise Amplifiers and antenna-coupled direct detectors will be researched and designed to additionally acquire spectroscopic material information. To overcome the current sensitivity and bandwidth limitations of silicon-integrated electronic circuits at higher frequencies up to 5 THz, research will focus on room temperature operated microbolometers. By introducing silicon-lens integrated high gain THz antennas, the microbolometer sensitivity will be enhanced. Based on this, C08 investigates novel packaging concepts to heterointegrate electronic and thermal detection principles on a common technology platform with a low noise readout chain to address the MARIE requirements in a mobile environment.

• DFG Programme: CRC/Transregios
• Subproject of: TRR 196: Mobile Material Characterization and Localization by Electromagnetic Sensing
• Applicant Institution: Universität Duisburg-Essen
• Project Heads: Professor Dr. Ullrich Pfeiffer; Dr. Sascha Weyers