SFB 440:  Assembly of hybrid Microsystems

• Subject Area: Computer Science, Systems and Electrical Engineering ; Computer Science, Systems and Electrical Engineering
• Term: from 1997 to 2009
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 5481537

Based on the research results achieved in the first approval period, knowledge about assembly and joining basics of hybrid microsystems shall be broadened. The development of microsystems is of no consequence here, but, however, the development of processes and methods for assembling and joining hybrid parts to a microsystem. Great store is set to the manufacturing-specific boundary conditions of the microsystem technique. During the first approval period, the difficulties in handling and process monitoring could be observed at the concrete part and process alternatives could be elaborated. Until a complete solution of the various tasks is reached, the higher ranking aims are remaining, though. Using the research results it shall be possible in future to support designers and manufacturers of technical microsystems in regard to handling, process monitoring, joining and structural designing with expert knowledge in order to allow also production of small- and medium-scale piece numbers in an economically efficient way and also of high quality.

• DFG Programme: Collaborative Research Centres

Completed projects

• A1 - Greifer und Monatagemaschinen (Project Head Brecher, Christian )
• A2 - Prozeßführung und Handhabung im Großkammer-REM (Project Head Weck, Manfred )
• A3 - Greiferintegration von Komponenten zum Laserstrahlfügen und zur Prozeßüberwachung (Project Heads Gillner, Arnold ;  Poprawe, Reinhart )
• A5 - Systemplattformen zu hybriden Mikrointegration (Project Head Mokwa, Wilfried )
• A7 - Montageunterstützende mechanische Strukturen zur passiven Justage von Mikrobauteilen (Project Head Brecher, Christian )
• B1 - Schweißen von Kunststoffen (Project Head Michaeli, Walter )
• B2 - Mikro-Montagespritzgießen (Project Head Michaeli, Walter )
• B3 - Mikrolöten - Prozeß- und Applikationsentwicklung (Project Head Bobzin, Kirsten )
• B4 - Mikroelektronenstrahlschweißen (Project Heads Brandenburg, Anette ;  Dilthey, Ulrich )
• B6 - Mikrolaserstrahlfügen artungleicher Werkstoffe (Project Head Gillner, Arnold )
• B7 - Schweißen von Kunststoffen (Project Head Haberstroh, Edmund )
• B8 - Mikroleben (Project Head Dilthey, Ulrich )
• B09 - Mehrdimensionales linienförmiges Mikrodosieren ungefüllter Klebstoffe (Project Head Dilthey, Ulrich )
• C1 - Prozeßvisualisierung und -regelung (Project Heads Freudenberg, Reinhard ;  Pfeifer, Tilo ;  Schmitt, Robert )
• C2 - Sensorentwicklung und -integration (Project Heads Freudenberg, Reinhard ;  Pfeifer, Tilo ;  Schmitt, Robert )
• D1 - Entwicklung von Lotwerkstoffen (Project Head Bobzin, Kirsten )
• E1 - Systemgerechte Gestaltung von Montageschnittstellen (Project Head Mokwa, Wilfried )
• T01 - Assembly of a hybrid micro-fluidic system in industrial environment (Project Head Michaeli, Walter )
• T02 - Laser Transmission Bonding of Silicon to Silicon on Wafer-Level and Chip-to-Wafer-Level (Project Head Gillner, Arnold )
• Z - Zentrale Aufgaben für den SFB (Project Head von den Brincken, Peter )
• Z1 - Zentrale Aufgaben für den SFB (Project Head von den Brincken, Peter )

• Applicant Institution: Rheinisch-Westfälische Technische Hochschule Aachen
• Participating Institution: Fraunhofer-Institut für Lasertechnik (ILT); Fraunhofer-Institut für Produktionstechnologie (IPT)
• Spokespersons: Professor Dr.-Ing. Ulrich Dilthey, from 7/2006 until 9/2007; Professor Dr.-Ing. Walter Michaeli, since 9/2007